With its own chipset, Samsung is now indeed play an important role in the chipset industry for their own Exynos chip has a satisfactory performance. We have seen how the performance of Galaxy S7 using Exynos 8890 chipset which managed to give an awesome performance. In addition, the Exynos 7870 chip also has managed to give a good perfroma with qualified power efficiency.
Previously, Samsung is also reportedly working on a new chipset using 14nm FinFET process which will be the entry-level chipset Exynos 7570 quad-core processor. Today the South Korean steel giant has announced it will soon begin mass production of the new chip Exynos 7 Dual 7270. As shown in the model number chipset, it will be stacked in a single chipset that still uses the 14nm FinFET process.
In the CPU chipset there will be a dual-core Cortex-A53 and will also support the 4G LTE network with the support (Cat.4 LTE modem 2Ca). In addition, unit 100 mm square also has Wi-Fi, Bluetooth, FM (frequency modulation) and GNSS (global navigation satellite system).
Thanks to the innovative idea of the Samsung SIP (system-in-package) technology ePoP (embedded package-on-package), Exynos 7 Dual 7270 can accumulate AP, DRAM and memory chips NAND flash and PMIC (power management IC) has been an area as small Unlike its predecessors, while reducing the height of 30%.
Of course with all the advantages of this chipset, it will be a huge capital and can be the candidate best chipset for wearable devices, because it not only has an impressive performance, but also has high efficiency.
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